Series Info:JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS;Volume: 28 Issue: 18 Pages: 13303-13312
Type:Article
Keywords:University for BI
,
HARDNESS
,
LEAD
,
GROWTH-RATE
,
COOLING RATE
,
EUTECTIC SOLDER
,
COMPOSITE SOLDERS
,
TEMPERATURE-GRADIENT
,
MECHANICAL-PROPERTIES
,
HYPOEUTECTIC SN-ZN
Abstract:
Mechanical properties of solders benefit from uniform dispersion of fine precipitates and small effective grain sizes. Metallurgical methods of attaining such a beneficial microstructure have been investigated in the plain Sn-6.5 wt%Zn-3 wt%In (plain) solder and Sn-6.5 wt%Zn-3 wt%In-0.3 wt%ZnO (composite) solder. It has been found that a small alloying addition of ZnO nano particles has a beneficial effect on the microstructure. It improves the tensile creep properties of the composite solder alloy. The improvement is attributed to uniform distribution and refining of the beta-Sn dendrites and the effective refined grain size in the solidified microstructure. Thereby the composite solder has better mechanical properties than the plain solder alloy.