Hussein, NFawzy, AEl-Daly, A. AAl-Ganainy, G. S2019-11-282019-11-282017-090957-4522https://doi.org/10.1007/s10854-017-7166-1https://link.springer.com/article/10.1007/s10854-017-7166-1Accession Number: WOS:000409027000007Mechanical properties of solders benefit from uniform dispersion of fine precipitates and small effective grain sizes. Metallurgical methods of attaining such a beneficial microstructure have been investigated in the plain Sn-6.5 wt%Zn-3 wt%In (plain) solder and Sn-6.5 wt%Zn-3 wt%In-0.3 wt%ZnO (composite) solder. It has been found that a small alloying addition of ZnO nano particles has a beneficial effect on the microstructure. It improves the tensile creep properties of the composite solder alloy. The improvement is attributed to uniform distribution and refining of the beta-Sn dendrites and the effective refined grain size in the solidified microstructure. Thereby the composite solder has better mechanical properties than the plain solder alloy.en-USUniversity for BIHARDNESSLEADGROWTH-RATECOOLING RATEEUTECTIC SOLDERCOMPOSITE SOLDERSTEMPERATURE-GRADIENTMECHANICAL-PROPERTIESHYPOEUTECTIC SN-ZNArticlehttps://doi.org/10.1007/s10854-017-7166-1